Digital Image Correlation (DIC)
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DIC is an optical CAE method that makes use of stereoscopic technology to track displacements and strains of a target surface over time. The surface is tracked by using a random surface pattern (commonly referred to as “speckling”).
The simplest embodiment of DIC requires the use of a single high-speed camera and enables the analyst to extract the planar stress and strain condition of a target surface.
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3D DIC involves two cameras in a stereoscopic arrangement. Like our eyes, each camera records the same event from a slightly different perspective. Advanced computer processing can then help the analyst to reconstruct a complete 3D view of the target surface. We are expert users of DIC and we have experience in using it for high value loadcases where deformations are difficult to measure using traditional methods (blast and ballistics testing). We use the GOM Correlate software which is an industry standard digital image correlation and evaluation software for materials research and component testing.
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DIC is the ultimate CAE tool for the correlation of numerical models and the experimental measurement of dynamic deformations. Please see our Case Study which details the application of 3D Digital Image Correlation to blast load cases.
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